Protecting Photomasks & Wafers
Pozzetta will protect your valuable products from particles, ESD damage, outgassed components, and high costsArchive for photomask
No Touch Box for 125mm square substrates
Our PLS655 box offers a unique solution for critical 125mm (5 inch) square substrates.
No touch standoff
No-touch design. The AU standoffs are angled, so only the edges of the substrate are touched and the substrate is suspended.
Features include: Positive locking latch, seal gasket, removable labels, long life hinges, stackable, easy open and close, and excellent access for insertion or removal of masks.
SPIE Photomask Technology 2011, Monterey CA
Monterey, CA 19-22 September
SPIE Photomask Technology is the premier event for EUV mask making, emerging mask technologies, and the entire photomask industry.
Visit Scott and Artemis at booth # 107
Exhibition Dates and Hours:
Tuesday 20 September Exhibit. . . . . . . . 10:00 am to 4:00 pm
Tuesday 20 September Poster/Reception 6:00 pm to 7:30 pm
Wednesday 21 September Exhibit . . . . . . 10:00 am to 4:00 pm
Semicon West Booth # 2509 in South Hall
We are looking forward to exhibiting again this year.
Scott, Collin and Artemis will be waiting for you so be sure to visit our booth!
Visit us at SPIE Advanced Lithography
Attend the Free Exhibition and visit our booth #309
Conference: February 27th to March 3rd 2011
Exhibit: Tuesday March 1st and Wednesday March 2nd 2011
San Jose Convention Center
San Jose, California, USA
We look forward to meeting you!
Reticle SMIF Pod
Reticle SMIF Pod
This Standard Mechanical Interface Pod accommodates 6025 mask with pellicle.
RSP200
Haze Control: Pod Shell made from low outgassing E80 resin.
Proprietary design of reticle support. Retainer makes contact with only reticle edge.
Clear shell provides visibility to inspect reticle location and barcode.
High performance PTFE filter; .03DOP% removal rating.
Plastic Peek screws used for easy disassembly/exchange of parts and easier maintenance.
Metal free attachment eliminates reticle scratching.
Pozzetta to Attend SPIE Advanced Lithography
Pozzetta will attend the most important event in semiconductor lithography.
Visit our booth # 625 at SPIE Advanced Lithography
Conference: February 21st to 25th 2010
Exhibit: February 23rd to 24th 2010
San Jose Convention Center
San Jose, California, USA
Pozzetta to Attend EMLC in Grenoble
The 26th European Mask and Lithography Conference EMLC will take place from January 18 – 22, 2010 in Grenoble, France.
We would like to welcome you at our booth!
Preventing ESD Damage
Pozzetta selects photomask compact materials after careful and thorough analysis of their ability to protect against ESD damage. After material selection we monitor the complete manufacturing process through third party ESD testing to make sure each material is performing to it’s reported specifications. Our continued testing and research has helped us identify and control several variables in the manufacturing process that will impact a compacts ability to deliver it’s maximum ESD protection.
