Protecting Photomasks & Wafers
Pozzetta will protect your valuable products from particles, ESD damage, outgassed components, and high costsArchive for particles
SPIE Photomask Technology 2011, Monterey CA
Monterey, CA 19-22 September
SPIE Photomask Technology is the premier event for EUV mask making, emerging mask technologies, and the entire photomask industry.
Visit Scott and Artemis at booth # 107
Exhibition Dates and Hours:
Tuesday 20 September Exhibit. . . . . . . . 10:00 am to 4:00 pm
Tuesday 20 September Poster/Reception 6:00 pm to 7:30 pm
Wednesday 21 September Exhibit . . . . . . 10:00 am to 4:00 pm
Pozzetta to Attend EMLC in Grenoble
The 26th European Mask and Lithography Conference EMLC will take place from January 18 – 22, 2010 in Grenoble, France.
We would like to welcome you at our booth!
No Contact Wafer Transfer
Pozzetta is proud to introduce the Bernoulli Chuck for non contact wafer transfers. Watch a demonstration . Utilizing the Bernoulli Principle, this wafer transfer device lifts wafers during handling and transfer without making contact with the wafer surface. The relative air flow parallel to the top surface of the wafer is faster than along the bottom surface. The pressure on the surface of the wafer will be lower above than below, and this pressure difference results in an upwards lift of the wafer.
For 200mm & 300mm
No contact with wafer
Utilizes compressed air
ESD safe acrylic resin
Conductive nylon
One hand operation
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Custom Secure Environment
Custom design is at the heart of Pozzetta Products strength. Just becuase it is not on our website, does not mean we will not try it!
We yet again have applied our many years of experience in confronting ESD, outgassing, and particles to another custom application.
A leading probe card manufacturer found a less expensive and far superior product in our custom designed Universal Core Box. Our project team of engineers, toolmakers and molding professionals worked hand in glove with our customer to create this product. The result was a revolutionary concept in secure environments. The inside is customizable to accommodate any component within the 3 1/2 inch square footprint. This product is designed for components used in the semiconductor, optics, solar, and thinfilms industries where ESD and particles are always a concern. We custom engrave logos, part number etc to the outside.
